Precision Laser Cutting

Custom shapes, holes, patterns and more...

Custom Laser Marking & Engraving

Serial numbers for tracking, markings for alignment and more...


Glass Laser Cutting

Sydor Optics can laser cut fused silica and fused quartz optical components such as wafers, windows and wedges. Whether you need custom laser cut shapes, patterns or holes, the highly skilled laser technicians at Sydor Optics will meet your tightest tolerances and specifications.

Glass Laser Marking

Laser marking is helpful in identifying, indexing, inventorying and aligning parts. Sydor Optics uses the Epilog Large Format Laser System for laser marking of glass. Laser marking is available on both the surface and edges of circular, square and custom shaped glass parts.


From concept to finished product, our laser technicians will work with you to test, adjust, and perfect the laser cutting and marking process specific to your design. Sydor Optics laser machining department produces can help bring your prototype products to production volumes with fast, rapid turnarounds.

Using state-of-the-art laser cutting and marking equipment, guided by highly-skilled experts, Sydor Optics can provide cost-effective solutions for cutting, marking and engraving your optical components both with or without optical coatings.

With a custom built beam delivery system, Sydor Optics laser technicians can overcome the challenges of laser cutting substrates with highly reflective coatings. Sydor Optics can even laser cut wafers or other finished optics that contain electronic components and laser mark virtually any type of glass including laser sensitive glass.

Laser Machining Manufacturing Limits

Manufacturing limits depend upon the part size and substrate material and are listed below for general reference. Sometimes, Sydor Optics can do more, so please contact a Sales Engineer, who will gladly discuss options based on your specifications.

Tighter tolerances are typically achieved on thinner materials.



Diameter 5mm – 600mm (± 0.025mm)
Length 5mm – 600mm (± 0.020mm)
Width 5mm – 600mm (± 0.020mm)
Thickness 0.2mm – 3mm
Hole Size ≥ 75um (± 0.010mm)
Hole Location ± 5um
Alignment ± 25um
Materials For Cutting fused silica / fused quartz
Materials For Marking all glass types (results vary by material)

Laser Machining Capabilities