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Custom Glass Wafer Fabrication

Sydor Optics has decades of experience polishing precision glass wafers. Aside from standard size glass wafers such as 100mm, 150mm, 200mm and 300mm, Sydor Optics can provide custom wafers with diameters up to 450mm and thin wafers with thicknesses down to 0.1mm (± 0.003mm).

With the largest collection of double-sided grinding and polishing machines in North America, Sydor Optics has the flexibility to easily ramp up wafer manufacturing from prototype to high-volume production.  Regardless of the size or scope of your project, our experienced engineers and technicians will guide you every step of the way.

Sydor Optics also offers a variety of glass wafer services including wafer thinning (back-thinning or back-grinding), ultrasonic cleaning & spin rinse drying in a cleanroom environment, cleanroom packaging and CNC machining for mechanical alterations such as flats, notches & bevels. Additional customizations can be made utilizing laser cutting & marking capabilities for adding features such as serial numbers, custom shapes and patterns or laser dicing. All Sydor Optics glass wafers go through a meticulous metrology and inspection process to ensure that your products are in spec and of the highest quality possible.

Available Materials

Based upon customer demand, Sydor Optics offers glass wafers made from the following substrate materials. Of course, if you don’t see a material you need, please contact a Sales Engineer, who will gladly discuss additional options that may be available.


Fused Quartz Wafers


Fused Silica Wafers


BOROFLOAT® (Borosilicate) Wafers


B 270® Wafers


N-BK7® (S-BSL7) Wafers


Pyrex® Wafers (now BOROFLOAT®)


ZERODUR® Wafers


ULE Wafers


Silicon Wafers

Glass Wafer Manufacturing Limits

Manufacturing limits depend upon the part size and substrate material and should be used as a general reference. Please contact a Sales Engineer, who will gladly discuss our capabilities based on your specifications.

Specifications

Measurements

Diameter ≤ 450mm
Thickness ≥ 0.1mm
Thickness Tolerance ± 0.003mm
Bow / Warp ≥ 3μm
TTV ≤ 1μm
Surface Roughness ≥ 5 Å rms
Parallelism ≥ 1 arc seconds
Cosmetics (MIL-PRF-13830B) 60-40 to 10-5
Edge Exclusion Zone (Clear Aperture) ≥ 3mm
Transmitted Wavefront Error (TWE) ≥ 1/10 wave over 25mm sub-aperture
Reflected Wavefront Error – RWE (Local Site Flatness) ≥ 1/10 wave over 25mm sub-aperture
Bevels 45° or c-bevel
SEMI Notch yes
SEMI Flat primary & secondary

Wafer Bevels, Notches & Flats

Sydor Optics offers industry-standard 45°, 90° & 180° SEMI Flats, SEMI Notches, 45° Bevels and C-Shaped Bevels. These features can be customized to meet your specifications. Learn more about additional optics manufacturing capabilities.

SEMI Wafer Flat
SEMI Wafer Secondary Flat
SEMI Wafer Notch
Wafer Bevels

In-Stock Wafers

Sydor Optics stocks 3 different 100mm diameter wafers which ship within 2-3 business days.

Click Here For Stock Wafer Specifications

If the stock glass wafers do not fit your needs, please contact a Sales Engineer to discuss your precision wafer requirements.

Fused Silica Wafer – Part #: S1000314

Specification

Measurement

Material Corning 7980
Diameter 100mm (+/- 0.1mm)
Thickness 0.5mm (+/- 0.05mm)
Bow 20µm
Warp 25µm
TTV ≤ 2µm
Surface Roughness ≤ 10 Å rms
Parallelism  < 2 arc seconds
Surface Quality 40-20 (both sides)
Clear Aperture 85% central
Bevels c-shape
SEMI Notch none
SEMI Flat none

Fused Silica Wafer – Part #: S1000315

Specification

Measurement

Material Corning 7980
Diameter 100mm (+/- 0.1mm)
Thickness 1mm (+/- 0.05mm)
Bow 10µm
Warp 15µm
TTV ≤ 2µm
Surface Roughness ≤ 10 Å rms
Parallelism  < 2 arc seconds
Surface Quality 40-20 (both sides)
Clear Aperture 85% central
Bevels c-shape
SEMI Notch none
SEMI Flat none

BOROFLOAT® Wafer – Part #: S1000316

Specification

Measurement

Material BOROFLOAT®
Diameter 100mm (+/- 0.1mm)
Thickness 0.5mm (+/- 0.05mm)
Bow 20µm
Warp 25µm
TTV ≤ 2µm
Surface Roughness ≤ 12 Å rms
Parallelism  < 2 arc seconds
Surface Quality 40-20 (both sides)
Clear Aperture 85% central
Bevels c-shape
SEMI Notch none
SEMI Flat none

Wafer Applications


Carrier Wafers


MEMS Wafers


Microfluidics


Diffractive Optics


Microlens Arrays


Wafer Level Packaging


Biochips


Micro Optics


Anodic Bonding


Photolithography


Pressure Sensors


Structuring