Custom Glass Wafer Fabrication
Sydor Optics has decades of experience polishing precision glass wafers. Aside from standard size glass wafers such as 100mm, 150mm, 200mm and 300mm, Sydor Optics can provide custom wafers with diameters up to 450mm and thin wafers with thicknesses down to 0.1mm (± 0.003mm).
With the largest collection of double-sided grinding and polishing machines in North America, Sydor Optics has the flexibility to easily ramp up wafer manufacturing from prototype to high-volume production. Regardless of the size or scope of your project, our experienced engineers and technicians will guide you every step of the way.
Sydor Optics also offers a variety of glass wafer services including wafer thinning (back-thinning or back-grinding), ultrasonic cleaning & spin rinse drying in a cleanroom environment, cleanroom packaging and CNC machining for mechanical alterations such as flats, notches & bevels. Additional customizations can be made utilizing laser cutting & marking capabilities for adding features such as serial numbers, custom shapes and patterns or laser dicing. All Sydor Optics glass wafers go through a meticulous metrology and inspection process to ensure that your products are in spec and of the highest quality possible.